Pressure sensitive keys

ABSTRACT

Pressure sensitive key techniques are described. In one or more implementations, a device includes at least one pressure sensitive key having a flexible contact layer spaced apart from a sensor substrate by a spacer layer, the flexible contact layer configured to flex responsive to pressure to contact the sensor substrate to initiate an input, for a computing device, associated with the pressure sensitive key. At least one of the flexible contact layer or the sensor substrate are configured to at least partially normalize an output resulting from pressure applied at a first location of the flexible contact layer with an output resulting from pressure applied at a second location of the flexible contact layer that has lesser flexibility than the first location.

RELATED APPLICATIONS

This application claims priority under 35 U.S.C. §119(e) to thefollowing U.S. Provisional Patent Applications, the entire disclosuresof each of these applications being incorporated by reference in theirentirety:

U.S. Provisional Patent Application No. 61/606,321, filed Mar. 2, 2012,and titled “Screen Edge;”

U.S. Provisional Patent Application No. 61/606,301, filed Mar. 2, 2012,and titled “Input Device Functionality;”

U.S. Provisional Patent Application No. 61/606,313, filed Mar. 2, 2012,and titled “Functional Hinge;”

U.S. Provisional Patent Application No. 61/606,333, filed Mar. 2, 2012,and titled “Usage and Authentication;”

U.S. Provisional Patent Application No. 61/613,745, filed Mar. 21, 2012,and titled “Usage and Authentication;”

U.S. Provisional Patent Application No. 61/606,336, filed Mar. 2, 2012,and titled “Kickstand and Camera;” and

U.S. Provisional Patent Application No. 61/607,451, filed Mar. 6, 2012,and titled “Spanaway Provisional;” and further this applicationincorporates the following applications by reference in their entirety:

U.S. patent application Ser. No. 13/470,633, filed May 14, 2012, andtitled “Flexible Hinge and Removable Attachment;”

U.S. patent application Ser. No. 13/471,186, filed May 14, 2012, andtitled “Input Device Layers and Nesting.”

BACKGROUND

Mobile computing devices have been developed to increase thefunctionality that is made available to users in a mobile setting. Forexample, a user may interact with a mobile phone, tablet computer, orother mobile computing device to check email, surf the web, composetexts, interact with applications, and so on. However, traditionalmobile computing devices often employed a virtual keyboard that wasaccessed using touchscreen functionality of the device. This wasgenerally employed to maximize an amount of display area of thecomputing device.

Use of the virtual keyboard, however, could be frustrating to a userthat desired to provide a significant amount of inputs, such as to entera significant amount of text to compose a long email, document, and soforth. Thus, conventional mobile computing devices were often perceivedto have limited usefulness for such tasks, especially in comparison withease at which users could enter text using a conventional keyboard,e.g., of a conventional desktop computer. Use of the conventionalkeyboards, though, with the mobile computing device could decrease themobility of the mobile computing device and thus could make the mobilecomputing device less suited for its intended use in mobile settings.

SUMMARY

Pressure sensitive key techniques are described. In one or moreimplementations, a pressure sensitive key includes a sensor substratehaving one or more conductors and a flexible contact layer spaced apartfrom the sensor substrate and configured to flex in response to anapplication of pressure to contact the sensor substrate. The flexiblecontact layer has a first location that is configured to contact thesensor substrate using force sensitive ink and a second location that isconfigured to contact the sensor substrate using force sensitive inksuch that the second location has increased conductivity than the firstlocation.

In one or more implementations, a pressure sensitive key includes aflexible contact layer configured to flex in response to an applicationof pressure and a sensor substrate spaced apart from the flexiblecontact layer and positioned for contact by the flexible contact layerresponsive to the application of pressure. The sensor substrate has oneor more conductors that are configured to be contacted by the flexiblecontact layer at first and second locations, the second locationconfigured to have increased conductivity in relation to the firstlocation.

In one or more implementations, a keyboard includes a plurality ofpressure sensitive keys configured to initiate inputs of a computingdevice, each of the plurality of pressure sensitive keys comprising aflexible contact layer spaced apart from a sensor substrate by a spacerlayer. The flexible contact layer is configured to flex in response toan application of pressure to contact the sensor substrate to initiatean input, for a computing device, associated with the pressure sensitivekey. The sensor substrate has one or more conductors that are configuredto be contacted by the flexible contact layer at respective first andsecond locations, the second location of the sensor substrate and theflexible contact layer configured to have increased conductivity inrelation to the first location of the sensor substrate and the flexiblecontact layer.

In one or more implementations, a device includes at least one pressuresensitive key having a flexible contact layer spaced apart from a sensorsubstrate by a spacer layer, the flexible contact layer configured toflex responsive to pressure to contact the sensor substrate to initiatean input, for a computing device, associated with the pressure sensitivekey. At least one of the flexible contact layer or the sensor substrateare configured to at least partially normalize an output resulting frompressure applied at a first location of the flexible contact layer withan output resulting from pressure applied at a second location of theflexible contact layer that has lesser flexibility than the firstlocation.

In one or more implementations, an input device includes a plurality ofpressure sensitive keys configured to initiate corresponding inputs of acomputing device. Each of the plurality of pressure sensitive keys isformed from a flexible contact layer spaced apart from a sensorsubstrate by a spacer layer. A first pressure sensitive key isconfigured to have a greater sensitivity to pressure than a secondpressure sensitive key through configuration of at least one ofrespective said flexible contact layers or respective said sensorsubstrates.

In one or more implementations, a keyboard includes a plurality ofpressure sensitive keys configured to initiate inputs of a computingdevice, each of the plurality of pressure sensitive keys includes aflexible contact layer spaced apart from a sensor substrate by a spacerlayer. The flexible contact layer is configured to flex responsive to apressure to contact the sensor substrate to initiate an input associatedwith the pressure sensitive key for a computing device. At least one ofthe flexible contact layer or the sensor substrate are configured to atleast partially normalize an output resulting from pressure applied at afirst location of the flexible contact layer with an output resultingfrom pressure applied at a second location of the flexible contactlayer, the second location positioned closer to an edge of the spacerlayer than the first location.

This Summary is provided to introduce a selection of concepts in asimplified form that are further described below in the DetailedDescription. This Summary is not intended to identify key features oressential features of the claimed subject matter, nor is it intended tobe used as an aid in determining the scope of the claimed subjectmatter.

BRIEF DESCRIPTION OF THE DRAWINGS

The detailed description is described with reference to the accompanyingfigures. In the figures, the left-most digit(s) of a reference numberidentifies the figure in which the reference number first appears. Theuse of the same reference numbers in different instances in thedescription and the figures may indicate similar or identical items.Entities represented in the figures may be indicative of one or moreentities and thus reference may be made interchangeably to single orplural forms of the entities in the discussion.

FIG. 1 is an illustration of an environment in an example implementationthat is operable to employ the techniques described herein.

FIG. 2 depicts an example implementation of an input device of FIG. 1 asshowing a flexible hinge in greater detail.

FIG. 3 depicts an example implementation showing a perspective view of aconnecting portion of FIG. 2 that includes mechanical couplingprotrusions and a plurality of communication contacts.

FIG. 4 depicts an example of a cross-sectional view of a pressuresensitive key of a keyboard of the input device of FIG. 2.

FIG. 5 depicts an example of a pressure sensitive key of FIG. 4 ashaving pressure applied at a first location of a flexible contact layerto cause contact with a corresponding first location of a sensorsubstrate.

FIG. 6 depicts an example of the pressure sensitive key of FIG. 4 ashaving pressure applied at a second location of the flexible contactlayer to cause contact with a corresponding second location of thesensor substrate.

FIG. 7 illustrates an example of the flexible contact layer of a singlepressure sensitive key that is configured to normalize outputs generatedat a plurality of locations of the switch.

FIG. 8 depicts an example of a pressure sensitive key of FIG. 4 thatincludes a plurality of sensors to detect pressure at differentlocations.

FIG. 9 depicts an example of conductors of a sensor substrate of apressure sensitive key that is configured to normalize signals generatedat different locations of the pressure sensitive key.

FIG. 10 illustrates an example system including various components of anexample device that can be implemented as any type of computing deviceas described with reference to FIGS. 1-9 to implement embodiments of thetechniques described herein.

DETAILED DESCRIPTION

Overview

Pressure sensitive keys may be used as part of an input device tosupport a relatively thin form factor, such as less than approximately3.5 millimeters. However, pressure sensitive keys may not provide adegree of feedback that is common with conventional mechanical keyboardsand therefore may result in missed hits and partial hits to intendedkeys of the keyboard. Further, conventional configuration of thepressure sensitive keys often resulted in different sensitivities due tothe flexibility of the material being deflected, e.g., greaterdeflection is generally observed at a central area of the key as opposedto an edge of the key. Therefore, conventional pressure sensitive keyscould result in an inconsistent user experience with a device thatemploys the keys.

Pressure sensitive key techniques are described. In one or moreimplementations, a pressure sensitive key is configured to provide anormalized output, e.g., to counteract differences in the flexibility atdifferent positions of the pressure sensitive key. For example,sensitivity at an edge of a key may be increased in comparison with thesensitivity at a center of the key to address the differences inflexibility of the key at those positions.

The sensitivity may be adjusted in a variety of ways. For example,sensitivity may be adjusted by increasing an amount of force sensitiveink at the edges of a flexible contact layer as opposed to a center ofthe flexibility contact layer. In another example, an amount ofconductors available to be contacted in a sensor substrate may beincreased. This may be performed in a variety of ways, such as througharrangement of gaps, amount of conductive material, surface area, and soon at an edge of a sensor substrate that is contacted by the flexiblecontact layer as opposed to at a center of the sensor substrate.

Sensitivity may also be adjusted for different keys. For example, keysthat are more likely to receive a lighter pressure (e.g., a key at abottom row, positioned near the edges of a keyboard, and so on) may beconfigured to have increased sensitivity in comparison with a key thatis likely to receive a higher amount of pressure, e.g., such as keys ina home row. In this way, normalization may also be performed betweenkeys of a keyboard as well as at the keys themselves. Further discussionof these and other features may be found in relation to the followingsections.

In the following discussion, an example environment is first describedthat may employ the techniques described herein. Example procedures arethen described which may be performed in the example environment as wellas other environments. Consequently, performance of the exampleprocedures is not limited to the example environment and the exampleenvironment is not limited to performance of the example procedures.

Example Environment

FIG. 1 is an illustration of an environment 100 in an exampleimplementation that is operable to employ the techniques describedherein. The illustrated environment 100 includes an example of acomputing device 102 that is physically and communicatively coupled toan input device 104 via a flexible hinge 106. The computing device 102may be configured in a variety of ways. For example, the computingdevice 102 may be configured for mobile use, such as a mobile phone, atablet computer as illustrated, and so on. Thus, the computing device102 may range from full resource devices with substantial memory andprocessor resources to a low-resource device with limited memory and/orprocessing resources. The computing device 102 may also relate tosoftware that causes the computing device 102 to perform one or moreoperations.

The computing device 102, for instance, is illustrated as including aninput/output module 108. The input/output module 108 is representativeof functionality relating to processing of inputs and rendering outputsof the computing device 102. A variety of different inputs may beprocessed by the input/output module 108, such as inputs relating tofunctions that correspond to keys of the input device 104, keys of avirtual keyboard displayed by the display device 110 to identifygestures and cause operations to be performed that correspond to thegestures that may be recognized through the input device 104 and/ortouchscreen functionality of the display device 110, and so forth. Thus,the input/output module 108 may support a variety of different inputtechniques by recognizing and leveraging a division between types ofinputs including key presses, gestures, and so on.

In the illustrated example, the input device 104 is configured as akeyboard having a QWERTY arrangement of keys although other arrangementsof keys are also contemplated. Further, other non-conventionalconfigurations are also contemplated, such as a game controller,configuration to mimic a musical instrument, and so forth. Thus, theinput device 104 and keys incorporated by the input device 104 mayassume a variety of different configurations to support a variety ofdifferent functionality.

As previously described, the input device 104 is physically andcommunicatively coupled to the computing device 102 in this examplethrough use of a flexible hinge 106. The flexible hinge 106 is flexiblein that rotational movement supported by the hinge is achieved throughflexing (e.g., bending) of the material forming the hinge as opposed tomechanical rotation as supported by a pin, although that embodiment isalso contemplated. Further, this flexible rotation may be configured tosupport movement in one direction (e.g., vertically in the figure) yetrestrict movement in other directions, such as lateral movement of theinput device 104 in relation to the computing device 102. This may beused to support consistent alignment of the input device 104 in relationto the computing device 102, such as to align sensors used to changepower states, application states, and so on.

The flexible hinge 106, for instance, may be formed using one or morelayers of fabric and include conductors formed as flexible traces tocommunicatively couple the input device 104 to the computing device 102and vice versa. This communication, for instance, may be used tocommunicate a result of a key press to the computing device 102, receivepower from the computing device, perform authentication, providesupplemental power to the computing device 102, and so on. The flexiblehinge 106 may be configured in a variety of ways, further discussion ofwhich may be found in relation to the following figure.

FIG. 2 depicts an example implementation 200 of the input device 104 ofFIG. 1 as showing the flexible hinge 106 in greater detail. In thisexample, a connection portion 202 of the input device is shown that isconfigured to provide a communicative and physical connection betweenthe input device 104 and the computing device 102. In this example, theconnection portion 202 has a height and cross section configured to bereceived in a channel in the housing of the computing device 102,although this arrangement may also be reversed without departing fromthe spirit and scope thereof.

The connection portion 202 is flexibly connected to a portion of theinput device 104 that includes the keys through use of the flexiblehinge 106. Thus, when the connection portion 202 is physically connectedto the computing device the combination of the connection portion 202and the flexible hinge 106 supports movement of the input device 104 inrelation to the computing device 102 that is similar to a hinge of abook.

For example, rotational movement may be supported by the flexible hinge106 such that the input device 104 may be placed against the displaydevice 110 of the computing device 102 and thereby act as a cover. Theinput device 104 may also be rotated so as to be disposed against a backof the computing device 102, e.g., against a rear housing of thecomputing device 102 that is disposed opposite the display device 110 onthe computing device 102.

Naturally, a variety of other orientations are also supported. Forinstance, the computing device 102 and input device 104 may assume anarrangement such that both are laid flat against a surface as shown inFIG. 1. In another instance, a typing arrangement may be supported inwhich the input device 104 is laid flat against a surface and thecomputing device 102 is disposed at an angle to permit viewing of thedisplay device 110, e.g., such as through use of a kickstand disposed ona rear surface of the computing device 102. Other instances are alsocontemplated, such as a tripod arrangement, meeting arrangement,presentation arrangement, and so forth.

The connecting portion 202 is illustrated in this example as includingmagnetic coupling devices 204, 206, mechanical coupling protrusions 208,210, and a plurality of communication contacts 212. The magneticcoupling devices 204, 206 are configured to magnetically couple tocomplementary magnetic coupling devices of the computing device 102through use of one or more magnets. In this way, the input device 104may be physically secured to the computing device 102 through use ofmagnetic attraction.

The connecting portion 202 also includes mechanical coupling protrusions208, 210 to form a mechanical physical connection between the inputdevice 104 and the computing device 102. The mechanical couplingprotrusions 208, 210 are shown in greater detail in the followingfigure.

FIG. 3 depicts an example implementation 300 shown a perspective view ofthe connecting portion 202 of FIG. 2 that includes the mechanicalcoupling protrusions 208, 210 and the plurality of communicationcontacts 212. As illustrated, the mechanical coupling protrusions 208,210 are configured to extend away from a surface of the connectingportion 202, which in this case is perpendicular although other anglesare also contemplated.

The mechanical coupling protrusions 208, 210 are configured to bereceived within complimentary cavities within the channel of thecomputing device 102. When so received, the mechanical couplingprotrusions 208, 210 promote a mechanical binding between the deviceswhen forces are applied that are not aligned with an axis that isdefined as correspond to the height of the protrusions and the depth ofthe cavity.

For example, when a force is applied that does coincide with thelongitudinal axis described previously that follows the height of theprotrusions and the depth of the cavities, a user overcomes the forceapplied by the magnets solely to separate the input device 104 from thecomputing device 102. However, at other angles the mechanical couplingprotrusion 208, 210 are configured to mechanically bind within thecavities, thereby creating a force to resist removal of the input device104 from the computing device 102 in addition to the magnetic force ofthe magnetic coupling devices 204, 206. In this way, the mechanicalcoupling protrusions 208, 210 may bias the removal of the input device104 from the computing device 102 to mimic tearing a page from a bookand restrict other attempts to separate the devices.

The connecting portion 202 is also illustrated as including a pluralityof communication contacts 212. The plurality of communication contacts212 is configured to contact corresponding communication contacts of thecomputing device 102 to form a communicative coupling between thedevices. The communication contacts 212 may be configured in a varietyof ways, such as through formation using a plurality of spring loadedpins that are configured to provide a consistent communication contactbetween the input device 104 and the computing device 102. Therefore,the communication contact may be configured to remain during minormovement of jostling of the devices. A variety of other examples arealso contemplated, including placement of the pins on the computingdevice 102 and contacts on the input device 104.

FIG. 4 depicts an example of a cross-sectional view of a pressuresensitive key 400 of a keyboard of the input device 104 of FIG. 2. Thepressure sensitive key 400 in this example is illustrated as beingformed using a flexible contact layer 402 (e.g., Mylar) that is spacedapart from the sensor substrate 404 using a spacer layer 406, 408, whichmay be formed as another layer of Mylar, formed on the sensor substrate404, and so on. In this example, the flexible contact layer 402 does notcontact the sensor substrate 404 absent application of pressure againstthe flexible contact layer 402.

The flexible contact layer 402 in this example includes a forcesensitive ink 410 disposed on a surface of the flexible contact layer402 that is configured to contact the sensor substrate 404. The forcesensitive ink 410 is configured such that an amount of resistance of theink varies directly in relation to an amount of pressure applied. Theforce sensitive ink 410, for instance, may be configured with arelatively rough surface that is compressed against the sensor substrate404 upon an application of pressure against the flexible contact layer402. The greater the amount of pressure, the more the force sensitiveink 410 is compressed, thereby increasing conductivity and decreasingresistance of the force sensitive ink 410. Other conductors may also bedisposed on the flexible contact layer 402 without departing form thespirit and scope therefore, including other types of pressure sensitiveand non-pressure sensitive conductors.

The sensor substrate 404 includes one or more conductors 412 disposedthereon that are configured to be contacted by the force sensitive ink410 of the flexible contact layer 402. When contacted, an analog signalmay be generated for processing by the input device 104 and/or thecomputing device 102, e.g., to recognize whether the signal is likelyintended by a user to provide an input for the computing device 102. Avariety of different types of conductors 412 may be disposed on thesensor substrate 404, such as formed from a variety of conductivematerials (e.g., silver, copper), disposed in a variety of differentconfigurations as further described in relation to FIG. 9, and so on.

FIG. 5 depicts an example 500 of the pressure sensitive key 400 of FIG.4 as having pressure applied at a first location of the flexible contactlayer 402 to cause contact of the force sensitive ink 410 with acorresponding first location of the sensor substrate 404. The pressureis illustrated through use of an arrow in FIG. 5 and may be applied in avariety of ways, such as by a finger of a user's hand, stylus, pen, andso on. In this example, the first location at which pressure is appliedas indicated by the arrow is located generally near a center region ofthe flexible contact layer 402 that is disposed between the spacerlayers 406, 408. Due to this location, the flexible contact layer 402may be considered generally flexible and thus responsive to thepressure.

This flexibility permits a relatively large area of the flexible contactlayer 402, and thus the force sensitive ink 410, to contact theconductors 412 of the sensor substrate 404. Thus, a relatively strongsignal may be generated. Further, because the flexibility of theflexible contact layer 402 is relatively high at this location, arelatively large amount of the force may be transferred through theflexible contact layer 402, thereby applying this pressure to the forcesensitive ink 410. As previously described, this increase in pressuremay cause a corresponding increase in conductivity of the forcesensitive ink and decrease in resistance of the ink. Thus, therelatively high amount of flexibility of the flexible contact layer atthe first location may cause a relatively stronger signal to begenerated in comparison with other locations of the flexible contactlayer 402 that located closer to an edge of the key, an example of whichis described in relation to the following figure.

FIG. 6 depicts an example 600 of the pressure sensitive key 400 of FIG.4 as having pressure applied at a second location of the flexiblecontact layer 402 to cause contact with a corresponding second locationof the sensor substrate 404. In this example, the second location ofFIG. 6 at which pressure is applied is located closer to an edge of thepressure sensitive key (e.g., closer to an edge of the spacer layer 406)than the first location of FIG. 5. Due to this location, the flexiblecontact layer 402 has reduced flexibility when compared with the firstlocation and thus less responsive to pressure.

This reduced flexibility may cause a reduction in an area of theflexible contact layer 402, and thus the force sensitive ink 410, thatcontacts the conductors 412 of the sensor substrate 404. Thus, a signalproduced at the second location may be weaker than a signal produced atthe first location of FIG. 5.

Further, because the flexibility of the flexible contact layer 402 isrelatively low at this location, a relatively low amount of the forcemay be transferred through the flexible contact layer 402, therebyreducing the amount of pressure transmitted to the force sensitive ink410. As previously described, this decrease in pressure may cause acorresponding decrease in conductivity of the force sensitive ink andincrease in resistance of the ink in comparison with the first locationof FIG. 5. Thus, the reduced flexibility of the flexible contact layer402 at the second location in comparison with the first location maycause a relatively weaker signal to be generated. Further, thissituation may be exacerbated by a partial hit in which a smaller portionof the user's finger is able to apply pressure at the second location ofFIG. 6 in comparison with the first location of FIG. 5.

However, as previously described techniques may be employed to normalizeoutputs produced by the switch at the first and second locations. Thismay be performed in a variety of ways, such as through configuration ofthe flexible contact layer 402 as described in relation to FIG. 7, useof a plurality of sensors as described in relation to FIG. 8,configuration of the sensor substrate 404 as described in relation toFIG. 9, and combinations thereof as further described in relation to thefollowing figures.

FIG. 7 illustrates an example 700 of the flexible contact layer of asingle pressure sensitive key that is configured to normalize outputsgenerated at a plurality of locations of the switch. In this example, aview of the “bottom” or “underside” of the flexible contact layer 402 ofFIG. 4 is shown that is configured to contact the conductors 412 of thesensor substrate 404.

The flexible contact layer 402 is illustrated as having first and secondsensing areas 702, 704. The first sensing area 702 in this examplecorresponds generally to the first location at which pressure wasapplied in FIG. 5 and the second sensing area 704 corresponds generallyto the second location at which pressure was applied in FIG. 6.

As previously described, flexing of the flexible contact layer 402 dueto changes in distances from an edge of the switch may cause relativelystronger signals to be generated as distances increase from an edge ofthe key. Therefore, in this example the first and second sensing areas702, 704 are configured to normalize the signals 706 generated at thedifferent locations. This may be done in a variety of ways, such as byhaving a higher conductivity and less resistance at the second sensingarea 704 in comparison with the first sensing area 702.

The differences in conductivity and/or resistance may be achieved usinga variety of techniques. For example, one or more initial layers of aforce sensitive ink may be applied to the flexible contact layer 402that covers the first and second sensing areas 704, 702, such as throughuse of a silk screen, printing process, or other process by which theink may be disposed against the surface. One or more additional layersmay then be applied to the second sensing area 704 and not the firstsensing area 702.

This causes the second sensing area 704 to have a greater amount (e.g.,thickness) of the force sensitive ink than the first sensing area 702for a given area, which causes a corresponding increase in conductivityand decrease in resistance. Therefore, this technique may serve to atleast partially counteract the differences in flexibility of theflexible contact layer 404 at different locations. In this example, anincreased height of the force sensitive ink at the second sensing area704 may also act to reduce an amount of flexing involved in generatingcontact with the conductors 412 of the sensor substrate 404, which mayalso help to normalize the signals.

The differences in conductivity and/or resistance at the first andsecond sensing areas 702, 704 may be achieved in a variety of otherways. For example, a first force sensitive ink may be applied at thefirst sensing area 702 and a second force sensitive ink having a higherconductivity and/or resistance may be applied at the second sensing area704. Further, although an arrangement of first and second sensing areas702, 704 as “nested” is shown in FIG. 7, a variety of other arrangementsmay also be employed, such as to further increase sensitivity at thecorners of the switch, employ more than two sensing areas havingdifferent sensitivities to pressure, use of a gradient ofconductivities, and so forth. Other examples are also contemplated, suchas to support use of a plurality of sensors for a single key, an exampleof which is described in relation to the following figure.

FIG. 8 depicts an example 800 of a pressure sensitive key of FIG. 4 thatincludes a plurality of sensors to detect pressure at differentlocations. As previously described, miss hits and limitations offlexibility may cause reduced performance at edges of a pressuresensitive key.

Accordingly, in this example a first sensor 802 and a second sensor 804are employed to provide respective first and second sensor signals 806,808, respectively. Further, the second sensor 804 is configured to haveincreased sensitivity (e.g., higher conductivity and/or lowerresistance) that the first sensor 802. This may be achieved in a varietyof ways, such as through different conductors and configurations of theconductors to act as sensors as part of the sensor substrate 404. Otherconfigurations of the sensor substrate 404 may also be made to normalize404 signals generated by the pressure sensitive key at differentlocations of the key, an example of which is described in relation tothe discussion of the following figure.

FIG. 9 depicts an example of conductors 412 of a sensor substrate 404that are configured to normalize signals generated at differentlocations of a pressure sensitive key. In this example, conductors 412of the sensor substrate 404 are configured in first and second portions902, 904 of inter-digitated trace fingers. Surface area, amount ofconductors, and gaps between the conductors are used in this example toadjust sensitivity at different locations of the sensor substrate 404.

For example, pressure may be applied to a first location 906 may cause arelatively larger area of the force sensitive ink 410 of the flexiblecontact layer 402 to contact the conductors in comparison with a secondlocation 908 of the sensor substrate 404. As shown in the illustratedexample, an amount of conductor contacted at the first location 906 isnormalized by an amount of conductor contacted at the second portion 906through use of gap spacing and conductor size. In this way, by usingsmaller conductors (e.g., thinner fingers) and larger gaps at the centerof the key as opposed to the edge of the key specific performancecharacteristics for the keys may be adjusted to suite typical user inputscenarios. Further, these techniques for configuring the sensorsubstrate 404 may be combined with the techniques described forconfiguring the flexible contact layer 402 to further promotenormalization and desired user input scenarios.

Returning again to FIG. 2, these techniques may also be leveraged tonormalize and support desired configuration of different keys, such asto normalize a signal generated by a first key of a keyboard of theinput device 104 with a signal generated by a second key of thekeyboard. As shown in the QWERTY arrangement of FIG. 3 (although this isequally applicable to other arrangements), users are more likely toapply greater typing pressure to a home row of keys located at a centerof the input device 104 than keys located closer to the edges of thedevice. This may include initiation using fingernails of a user's handfor the shift key row as well as an increased distance to reach for thenumbers, different strengths of different fingers (index versus pinkyfinger), and so on.

Accordingly, the techniques described above may also be applied tonormalize signals between these keys, such as to increase sensitivity ofnumber keys in relation to home row keys, increase sensitivity of“pinky” keys (e.g., the letter “a” and semicolon key) as opposed toindex finger keys (e.g., the letters “f,” “g,” “h,” and “j”), and soforth. A variety of other examples are also contemplated involvingchanges to sensitivity, such as to make keys having a smaller surfacearea (e.g., the delete button in the figure) more sensitive incomparison with larger keys, such as the shift keys, spacebar, and soforth.

Example System and Device

FIG. 10 illustrates an example system generally at 1000 that includes anexample computing device 1002 that is representative of one or morecomputing systems and/or devices that may implement the varioustechniques described herein. The computing device 1002 may be, forexample, be configured to assume a mobile configuration through use of ahousing formed and size to be grasped and carried by one or more handsof a user, illustrated examples of which include a mobile phone, mobilegame and music device, and tablet computer although other examples arealso contemplated.

The example computing device 1002 as illustrated includes a processingsystem 1004, one or more computer-readable media 1006, and one or moreI/O interface 1008 that are communicatively coupled, one to another.Although not shown, the computing device 1002 may further include asystem bus or other data and command transfer system that couples thevarious components, one to another. A system bus can include any one orcombination of different bus structures, such as a memory bus or memorycontroller, a peripheral bus, a universal serial bus, and/or a processoror local bus that utilizes any of a variety of bus architectures. Avariety of other examples are also contemplated, such as control anddata lines.

The processing system 1004 is representative of functionality to performone or more operations using hardware. Accordingly, the processingsystem 1004 is illustrated as including hardware element 1010 that maybe configured as processors, functional blocks, and so forth. This mayinclude implementation in hardware as an application specific integratedcircuit or other logic device formed using one or more semiconductors.The hardware elements 1010 are not limited by the materials from whichthey are formed or the processing mechanisms employed therein. Forexample, processors may be comprised of semiconductor(s) and/ortransistors (e.g., electronic integrated circuits (ICs)). In such acontext, processor-executable instructions may beelectronically-executable instructions.

The computer-readable storage media 1006 is illustrated as includingmemory/storage 1012. The memory/storage 1012 represents memory/storagecapacity associated with one or more computer-readable media. Thememory/storage component 1012 may include volatile media (such as randomaccess memory (RAM)) and/or nonvolatile media (such as read only memory(ROM), Flash memory, optical disks, magnetic disks, and so forth). Thememory/storage component 1012 may include fixed media (e.g., RAM, ROM, afixed hard drive, and so on) as well as removable media (e.g., Flashmemory, a removable hard drive, an optical disc, and so forth). Thecomputer-readable media 1006 may be configured in a variety of otherways as further described below.

Input/output interface(s) 1008 are representative of functionality toallow a user to enter commands and information to computing device 1002,and also allow information to be presented to the user and/or othercomponents or devices using various input/output devices. Examples ofinput devices include a keyboard, a cursor control device (e.g., amouse), a microphone, a scanner, touch functionality (e.g., capacitiveor other sensors that are configured to detect physical touch), a camera(e.g., which may employ visible or non-visible wavelengths such asinfrared frequencies to recognize movement as gestures that do notinvolve touch), and so forth. Examples of output devices include adisplay device (e.g., a monitor or projector), speakers, a printer, anetwork card, tactile-response device, and so forth. Thus, the computingdevice 1002 may be configured in a variety of ways to support userinteraction.

The computing device 1002 is further illustrated as beingcommunicatively and physically coupled to an input device 1014 that isphysically and communicatively removable from the computing device 1002.In this way, a variety of different input devices may be coupled to thecomputing device 1002 having a wide variety of configurations to supporta wide variety of functionality. In this example, the input device 1014includes one or more keys 1016, which may be configured as pressuresensitive keys, mechanically switched keys, and so forth.

The input device 1014 is further illustrated as include one or moremodules 1018 that may be configured to support a variety offunctionality. The one or more modules 1018, for instance, may beconfigured to process analog and/or digital signals received from thekeys 1016 to determine whether a keystroke was intended, determinewhether an input is indicative of resting pressure, supportauthentication of the input device 1014 for operation with the computingdevice 1002, and so on.

Various techniques may be described herein in the general context ofsoftware, hardware elements, or program modules. Generally, such modulesinclude routines, programs, objects, elements, components, datastructures, and so forth that perform particular tasks or implementparticular abstract data types. The terms “module,” “functionality,” and“component” as used herein generally represent software, firmware,hardware, or a combination thereof. The features of the techniquesdescribed herein are platform-independent, meaning that the techniquesmay be implemented on a variety of commercial computing platforms havinga variety of processors.

An implementation of the described modules and techniques may be storedon or transmitted across some form of computer-readable media. Thecomputer-readable media may include a variety of media that may beaccessed by the computing device 1002. By way of example, and notlimitation, computer-readable media may include “computer-readablestorage media” and “computer-readable signal media.”

“Computer-readable storage media” may refer to media and/or devices thatenable persistent and/or non-transitory storage of information incontrast to mere signal transmission, carrier waves, or signals per se.Thus, computer-readable storage media refers to non-signal bearingmedia. The computer-readable storage media includes hardware such asvolatile and non-volatile, removable and non-removable media and/orstorage devices implemented in a method or technology suitable forstorage of information such as computer readable instructions, datastructures, program modules, logic elements/circuits, or other data.Examples of computer-readable storage media may include, but are notlimited to, RAM, ROM, EEPROM, flash memory or other memory technology,CD-ROM, digital versatile disks (DVD) or other optical storage, harddisks, magnetic cassettes, magnetic tape, magnetic disk storage or othermagnetic storage devices, or other storage device, tangible media, orarticle of manufacture suitable to store the desired information andwhich may be accessed by a computer.

“Computer-readable signal media” may refer to a signal-bearing mediumthat is configured to transmit instructions to the hardware of thecomputing device 1002, such as via a network. Signal media typically mayembody computer readable instructions, data structures, program modules,or other data in a modulated data signal, such as carrier waves, datasignals, or other transport mechanism. Signal media also include anyinformation delivery media. The term “modulated data signal” means asignal that has one or more of its characteristics set or changed insuch a manner as to encode information in the signal. By way of example,and not limitation, communication media include wired media such as awired network or direct-wired connection, and wireless media such asacoustic, RF, infrared, and other wireless media.

As previously described, hardware elements 1010 and computer-readablemedia 1006 are representative of modules, programmable device logicand/or fixed device logic implemented in a hardware form that may beemployed in some embodiments to implement at least some aspects of thetechniques described herein, such as to perform one or moreinstructions. Hardware may include components of an integrated circuitor on-chip system, an application-specific integrated circuit (ASIC), afield-programmable gate array (FPGA), a complex programmable logicdevice (CPLD), and other implementations in silicon or other hardware.In this context, hardware may operate as a processing device thatperforms program tasks defined by instructions and/or logic embodied bythe hardware as well as a hardware utilized to store instructions forexecution, e.g., the computer-readable storage media describedpreviously.

Combinations of the foregoing may also be employed to implement varioustechniques described herein. Accordingly, software, hardware, orexecutable modules may be implemented as one or more instructions and/orlogic embodied on some form of computer-readable storage media and/or byone or more hardware elements 1010. The computing device 1002 may beconfigured to implement particular instructions and/or functionscorresponding to the software and/or hardware modules. Accordingly,implementation of a module that is executable by the computing device1002 as software may be achieved at least partially in hardware, e.g.,through use of computer-readable storage media and/or hardware elements1010 of the processing system 1004. The instructions and/or functionsmay be executable/operable by one or more articles of manufacture (forexample, one or more computing devices 1002 and/or processing systems1004) to implement techniques, modules, and examples described herein.

Conclusion

Although the example implementations have been described in languagespecific to structural features and/or methodological acts, it is to beunderstood that the implementations defined in the appended claims isnot necessarily limited to the specific features or acts described.Rather, the specific features and acts are disclosed as example forms ofimplementing the claimed features.

What is claimed is:
 1. A pressure sensitive key comprising: a sensorsubstrate having one or more conductors disposed directly underneath atouch input area of the pressure sensitive key; a flexible contact layercovering the pressure sensitive key, the flexible contact layer spacedapart from the sensor substrate, configured to flex in response to anapplication of pressure to the touch input area of the pressuresensitive key; and a .force sensitive ink disposed between the flexiblecontact layer and the conductors enabling electrical connections to bemade with the conductors via the force sensitive ink, the forcesensitive ink arranged under the flexible contact layer such that:responsive to pressure being applied to a first location within thetouch input area of the pressure sensitive key, a first electricalconnection is formed between the force sensitive ink and the conductorswith a first conductivity; and responsive to pressure being applied to asecond location within the touch input area of the pressure sensitivekey, a second electrical connection is formed between the forcesensitive ink and the conductors with a second conductivity that ishigher than the first conductivity.
 2. A pressure sensitive key asdescribed in claim 1, wherein the second location within the touch inputarea of the pressure sensitive key is positioned closer to an edge ofthe touch input area of the pressure sensitive key than the firstlocation within the touch input area of the pressure sensitive key.
 3. Apressure sensitive key as described in claim 1, wherein the forcesensitive ink used at the second location within the touch input area ofthe pressure sensitive key has increased conductivity than the forcesensitive ink used at the first location within the touch input area ofthe pressure sensitive key.
 4. A pressure sensitive key as described inclaim 1, wherein an amount of the force sensitive ink used at the secondlocation within the touch input area of the pressure sensitive key isgreater than an amount of the force sensitive ink used at the firstlocation within the touch input area of the pressure sensitive key.
 5. Apressure sensitive key as described in claim 4, wherein the amount ofthe force sensitive ink used at the second location within the touchinput area of the pressure sensitive key is applied using at least twolayers and the amount of the force sensitive ink used at the firstlocation within the touch input area of the pressure sensitive key isapplied using fewer layers than the layers used at the second locationwithin the touch input area of the pressure sensitive key.
 6. A pressuresensitive key as described in claim 5, wherein the application of theforce sensitive ink at the second location within the touch input areaof the pressure sensitive key using at least two layers causes theflexible contact layer to contact the sensor substrate using lessmovement than if fewer layers were utilized at the second locationwithin the touch input area of the pressure sensitive key.
 7. A pressuresensitive key as described in claim 1, wherein the higher conductivityat the second location within the touch input area of the pressuresensitive key in comparison with the first location acts to at leastpartially normalize signals generated at the first and second locationswithin the touch input area of the pressure sensitive key, one toanother.
 8. A pressure sensitive key as described in claim 1, whereinthe sensor substrate includes one or more conductors that are configuredto be contacted by the flexible contact layer at corresponding first andsecond locations respective to the first and second locations within thetouch input area of the pressure sensitive key, the second location ofthe sensor substrate configured to have increased conductivity inrelation to the first location of the sensor substrate.
 9. A pressuresensitive key as described in claim 8, wherein the second location ofthe sensor substrate is configured to have increased conductivity inrelation to the first location of the sensor substrate through spacingof respective said conductors in relation to each other.
 10. A pressuresensitive key as described in claim 8, wherein the second location ofthe sensor substrate is configured to have increased conductivity inrelation to the first location of the sensor substrate through surfacearea of respective said conductors.
 11. A pressure sensitive keycomprising: a flexible contact layer covering the pressure sensitive keyand configured to flex in response to an application of pressure; and asensor substrate disposed directly underneath a touch input area of theflexible contact layer of the pressure sensitive key spaced apart fromthe flexible contact layer and positioned for contact by the flexiblecontact layer responsive to the application of pressure, the sensorsubstrate having one or more conductors that are configured to becontacted by the flexible contact layer at first and second locationswithin the touch input area of the flexible contact layer of thepressure sensitive key enabling a first electrical connection to be madebetween the conductors having a first conductivity responsive to apressure input to the first location and enabimg a second electricalconnection to be made between the conductors having a secondconductivity that is different than the first conductivity responsive toa pressure input to the second location.
 12. A pressure sensitive key asdescribed in claim 11, wherein the second location of the touch inputarea of the flexible contact layer of the pressure sensitive key ispositioned closer to an edge of the pressure sensitive key than thefirst location of the touch input area of the flexible contact layer ofthe pressure sensitive key.
 13. A pressure sensitive key as described inclaim 11, wherein the second location of the touch input area of theflexible contact layer of the pressure sensitive key is configured tohave increased conductivity in relation to the first location of thetouch input area of the flexible contact layer of the pressure sensitivekey through spacing of respective said conductors in relation to eachother.
 14. A pressure sensitive key as described in claim 11, whereinthe second location of the touch input area of the flexible contactlayer of the pressure sensitive key is configured to have increasedconductivity in relation to the first location of the touch input areaof the flexible contact layer of the pressure sensitive key throughsurface area of respective said conductors.
 15. A pressure sensitive keyas described in claim 11, wherein the second location of the touch inputarea of the flexible contact layer of the pressure sensitive key isconfigured to have increased conductivity in relation to the firstlocation of the touch input area of the flexible contact layer of thepressure sensitive key through amount of conductive material used toform respective said conductors.
 16. A pressure sensitive key asdescribed in claim 11, wherein the flexible contact layer is configuredto flex to contact the first and second locations of the sensorsubstrate using respective first and second locations of the touch inputarea of the flexible contact layer of the pressure sensitive key, thesecond location of the touch input area of the flexible contact layer ofthe pressure sensitive key has increased conductivity than the firstlocation of the touch input area of the flexible contact layer of thepressure sensitive key.
 17. A pressure sensitive key as described inclaim 11, wherein a force sensitive ink is used at the second locationof the touch input area of the flexible contact layer of the pressuresensitive key that has a different conductivity than a force sensitiveink that is used at the first location of the touch input area of theflexible contact layer of the pressure sensitive key to achieve thefirst and second conductivities.
 18. A pressure sensitive key asdescribed in claim 11, wherein an amount of a force sensitive ink isused at the second location of the touch input area of the flexiblecontact layer of the pressure sensitive key that is greater than anamount of the force sensitive ink used at the first location of thetouch input area of the flexible contact layer of the pressure sensitivekey to achieve the first and second conductivities.
 19. A keyboardcomprising a plurality of pressure sensitive keys configured to initiateinputs of a computing device, each of the plurality of pressuresensitive keys comprising a flexible contact layer covering the key andspaced apart from a sensor substrate disposed directly underneath atouch input area of the flexible contact layer of the pressure sensitivekey by a spacer layer, the flexible contact layer configured to flex inresponse to an application of pressure to contact the sensor substrateto initiate an input, for a computing device, associated with thepressure sensitive key, the sensor substrate having one or moreconductors that are configured to be contacted by the flexible contactlayer at respective first and second locations corresponding to firstand second locations of the touch input area of the flexible contactlayer of the pressure sensitive key directly above the first and secondlocations of the sensor substrate enabling a first electrical correctionto be made between the conductors having a first conductivity responsiveto a pressure input to the first location and enabling a secondelectrical connection to be made between the conductors having a secondconductivity that is higher than the first conductivity responsive to apressure input to the second location.
 20. A keyboard as described inclaim 19, wherein at least a portion of the plurality of pressuresensitive keys is configured according to a QWERTY arrangement.